25.毫米波多芯片组件中金丝金带键合互连的特性(5)

毫米波多芯片组件中金丝金带键合互连的特性比较

参考文献：

[1] Masashi Hotta, Yongxi Qian, Tatsuo Itah. Resonant coupling type microstrip line interconnect

using bonding ribbon and dielectric PAD. 1998 IEEE MTT-S Digest:797～800

[2] Christoph Luechinger. Ribbon Bonding–A Scalable Interconnect for Power QFN Packages. 2007

9th Electronics Packaging Technology Conference

[3] T. Krems, W. Haydl, H. Massler, J. Rudiger, “Millimeter-wave performance of chip

interconnections using wire bonding and flip chip,” Proc. IEEE MTT-s. Dig., San Francisco, CA, pp. 247-250, 1996.

[4] H.Jin, R.Vahldieck, J.Huang etc. Rigorous analysis of mixed transmission line interconnects

using the frequency domain TLM method. IEEE Trans. Microwave Theory Tech, vol.41, no.12,pp.2248-2255,Dec.1993

作者简介：邹 军，男，1975年生，工程硕士，工程师。研究方向为微波电路封装和互连、微电路技术等。

联系方法： 025－51823815 13851515686、jun_zou@、南京雨花区国睿路8号3918信箱46分箱，

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