SMT 工艺流程基础(8)

SMT工艺流程及相关注意事项

反白/侧立:Gross Placement (GP) 线路短路:Track Short (TS) 浮高: Float PAD翘起:Lifted PAD

脚长:Lead too long 板翘: Twist Board

翘脚: Lifted Lead PAD沾绿油: Soldermask on PAD 脚拙: Lead too short PAD脱落:Missing PAD

未装Bumper: Missing Bumper PAD氧化:PAD Discoloration 螺丝松动:Loose Screw 裸鉰:Exposed Copper 未装螺丝:Missing Screw 氧泡:Blister

零件脚偏位:Part Pin Shift 组件破损:Component Damaged 压件:Excess Part 组件功能不良:Component Fail 折脚:Bent Lead (BL) 高低 Pin: Ineven Pin 少锡:Insafficient Solder (IS) 缺Pin: Missing Pin

空焊:Soldering Open 组件缺陷:Defeetive Part (DFP) 多锡/包锡: Soldering Open 方脚变色:Lead Discoloration 锡桥(短路):Solder Short (SS) 歪Pin :Twisted Pin 针洞/空洞: Pinholes/Void 弯Pin :Bent Pin

冷焊: Cold Solder 加热次数过多:Heat Cycle 锡尖:Solder Tip 锡裂:Soldering Crack

拒锡:Dewetting 虚焊:Unsoldered

焊接污染或焊接短路:Foreign Material (FM)

洗板:Washed Board (WB)