DG413中文资料(2)

元器件交易网DG411, DG412, DG413 Dual-In-Line Plastic Packages (PDIP)N E1 INDEX AREA 1 2 3 N/2

E16.3 (JEDEC MS-001-BB ISSUE D)16 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL-B-

MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 18.66 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 19.68 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93

MIN 0.015 0.115 0.014 0.045 0.008 0.735 0.005 0.300 0.240

MAX 0.210 0.195 0.022 0.070 0.014 0.775 0.325 0.280

AE A2 L A C L

-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1

A1 A2

-C-

B B1 C D D1 E

eA eCC

e

C A B S

eB

NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the“MO Series Symbol List” in Section 2.2 of Publicatio

n No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2+ 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).

E1 e eA eB L N

0.100 BSC 0.300 BSC 0.115 16 0.430 0.150

2.54 BSC 7.62 BSC 2.93 16 10.92 3.81

元器件交易网DG411, DG412, DG413 Small Outline Plastic Packages (SOIC)N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M B M

M16.15 (JEDEC MS-012-AC ISSUE C)16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL AL

MILLIMETERS MIN 1.35 0.10 0.33 0.19 9.80 3.80 MAX 1.75 0.25 0.51 0.25 10.00 4.00 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93

MIN 0.0532 0.0040 0.013 0.0075 0.3859 0.1497

MAX 0.0688 0.0098 0.020 0.0098 0.3937 0.1574

A1 B C D

αA1 0.10(0.004) C

E e H h L N

eB 0.25(0.010) M C A M B S

0.050 BSC 0.2284 0.0099 0.016 16 0o 8o 0.2440 0.0196 0.050

1.27 BSC 5.80 0.25 0.40 16 0o 6.20 0.50 1.27

NOTES: 1. Symbols are defined in the“MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension“D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension“E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6.“L” is the length of terminal for soldering to a substrate. 7.“N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width“B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.

α

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