CDR01BP109ABSR中文资料

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CERAMIC CHIP/MIL-PRF-55681

DIMENSIONS—MILLIMETERS AND (INCHES)

STYLE

KEMETSIZECODE

T

L

W

BW

CDR01CDR02CDR03CDR04CDR05CDR06CDR31CDR32CDR33CDR34CDR35

C0805C1805C1808C1812C1825C2225C0805C1206C1210C1812C18252.03 ±.38 (.080 ±.015)4.57 ±.38 (.180 ±.015)4.57 ±.38 (.180 ±.015)4.57 ±.38 (.180 ±.015)

+.51+.0204.57.180–.38–.0155.72 ±.51 (.225 ±.020)2.00 ±.20 (.078 ±.008)3.20 ±.20 (.125 ±.008)3.20 ±.25 (.125 ±.010)4.50 ±.25 (.176 ±.010)4.50 ±.30 (.176 ±.012)

1.27 ±.38 (.050 ±.015)1.27 ±.38 (.050 ±.015)2.03 ±.38 (.080 ±.015)3.18 ±.38 (.125 ±.015)+.51+.0206.35.250–.38–.0156.35 ±.51 (.250 ±.020)1.25 ±.20 (.049 ±.008)1.60 ±.20 (.062 ±.008)2.50 ±.25 (.098 ±.010)3.20 ±.25 (.125 ±.010)6.40 ±.30 (.250 ±.012)

.56 (.022).56 (.022).56 (.022).56 (.022).51 (.020).51 (.020)

1.40 (.055)1.40 (.055)2.03 (.080)2.03 (.080)2.03 (.080)2.03 (.080)1.30 (.051)1.30 (.051)1.50 (.059)1.50 (.059)1.50 (.059)

.51 ±0.25 (.020 ±.010).51 ±0.25 (.020 ±.010).51 ±0.25 (.020 ±.010).51 ±0.25 (.020 ±.010).51 ±0.25 (.020 ±.010).51 ±0.25 (.020 ±.010).50 ±0.20 (.020 ±.008).50 ±0.20 (.020 ±.008).50 ±0.25 (.020 ±.010) .50 ±0.25 (.020 ±.010) .50 ±0.30 (.020 ±.012)

Note: For Solderguard I(MIL-C55681 “S” or “U” Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the followingamounts:

Width/ThicknessLength

CDR010.51MM (.020)0.38MM (.015)CDR02-060.64MM (.025)0.38MM(.015)CDR31-350.60MM (.023)0.30MM(.012)

MIL-PRF-55681 PART NUMBER ORDERING INFORMATION

STYLE & SIZE CODE

STYLE

C— Ceramic

D— Dielectric, Fixed ChipR— Established Reliability

FAILURE RATE LEVEL(%/1000 hrs.)

TERMINATION FINISH

S — Solder Coated, Final(SolderGuardI)

U — Base Metalization—Barrier Metal—SolderCoated (SolderGuard I)

RATED TEMPERATURE

–55°C to +125°C

DIELECTRICS

P—±30 PPM/°C—WITH OR WITHOUT VOLTAGEX—±15%—without voltage

+ 15%, –25%—with voltage

W — Base Metalization—Barrier Metal—TinnedTin or (Tin/Lead Alloy)SolderGuard II

Y — Base MetalizationBarrier Metal—Tinned(100% Tin) Solderguard II

CAPACITANCE

CAPACITANCE TOLERANCE

BCDF±.1 pF±.25 pF±.5 pF±1%

J±5%

KM±10%±20%

Expressed in picofarads (pF).

First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)

RATED VOLTAGE

A — 50; B — 100

KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS

CERAMICSIZE CODE

See Table Above

END METALIZATION

C — SolderGuard II(100% Sn) (Military equiv:Y, W)H — SolderGuard I(Sn60) (Military equiv:S, U)

M — 1.0P — 0.1

SPECIFICATION

FAILURE RATE (%/1,000 hrs.)

R — 0.01S — 0.001

P-MIL-PRF-55681 = CDR01-CDR06N-MIL-PRF-55681 = CDR31-CDR35

CAPACITANCE CODE

Expressed in picofarads (pF).

First two digits represent significant figures.Third digit specifies number of zeros. (Use 9for 1.0 thru 9.9 pF. Example: 2.2 pF –229)

Designated by Capacitance

Change Over Temperature RangeG — BP(C0G/NP0) (±30 PPM/°C)X — BX (±15% Without Voltage+15% -25% With Voltage)

VOLTAGE TEMPERATURE CHARACTERISTIC

CAPACITANCE TOLERANCE

±±±±±±VOLTAGE

1 — 100V, 5 — 50V

* Part Number Example: C0805P101K1GMC(14 digits - no spaces)

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Ceramic Surface Mount

M — 1.0P — 0.1R — 0.01S — 0.001