SPI_Layout_Guide_AN(6)

针对高速SPI FLASH的PCB走线规则。

Application

Note

Figure 4.4 WSON Proposed Land Pattern

The WSON8 land pattern is shown above. It is recommended that the center slug should be solder mask define (SMD) to avoid bridging. The mask opening should be 0.05 – 0.1 mm smaller than the center pad on all four sides. At the pin, it should be NSMD with the mask opening 3 mil larger than the copper pad on all sides. At center slug, the stencil should also has small multiple openings with solder paste coverage about

40 – 70% of the exposed pad area to prevent bridging between the center slug and pins.